Product Description:TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and good compression set or memory. This material is available in thermally conductive & electrically insulating or conductive, one part or two part, room or elevated temperature curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.
Typical Appllication: LED bonding, PCBA to housing, discrete component to heat spreader, Computer and Peripherals and Automotive Electronics.
Most Popular Products:
TIM-LGF 2000:One part, heat cure silicone liquid gap filler ideal for coupling hot PC board components to heat sink. It forms soft elastomer in 15 minutes when expose to heat.
TIM-LGF 2004: Two part, room temperature cure, simple 1:1 mix ratio for easy application. Forms soft elastomer in 5 minutes when expose to heat. Very efficient heat dissipater.