TIMTRONICS - Thermal Interface Material  
 
TIM-800
Thermally Conductive Epoxies/Adhesives

Product Description :
TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.

 

Typical Applications :
Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.


Most Popular Products :

• TIM-813: One part heat cure system, excellent conductivity and bond strength at high temperature
• TIM-818: High strength, thermally conductive adhesive, flash cure in 5 minutes. No mix, two part system to replace mechanical clips, fasteners or tapes in securing heat generating devices and heat sink.



Property 813 813HTC 816 816HTC 818
Thermal Conductivity W/mºK
1.5
2.7
0.85
2.7
0.8
Type/Cure
One Part
Heat Cure
One Part
Heat Cure
Two Part
RT Cure
Two Part
RT Cure
Two Part
No Mix
Flash cure
Pot life(100grams)
½ hr @ 80°C
½ hr @ 80°C
½ hr @ 25°C
½ hr @ 25°C
5 minutes
@ 25°C
Shelf life
4 months
@25ºC
4 months
@25ºC
2 years
@25ºC
2 years
@25ºC
1 years
@25Cº
Dielectric strength, V/Mil
460
460
420
420
570
Max. Service Temperature ºC
270
270
150
150
150

Electrically Conductive

Product Description :
Electrically conductive adhesives are designed with pure silver and resin and are typically used for microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure of 1000 hours at 150°C.


Typical Applications :
Die-attach, chip bonding, cold soldering and other micro electronics bonding applications.



Property

897M-2

830M-1

Thermal Conductivity W/mºK

1.5 2.7
Type/Cure                                                                 

One Part-Heat Cure

Two Part-RT Cure

Pot life(100grams)

½ hr @ 80°C

1hr @ 25°C

Cure Schedule

1 hr @ 100°C

48 hrs @ 25°C

Shelf life

4 months @ 0°C

1 Year @25°C

Volume Resistivity  Ohm-cm

0.0004

0.002

Max. Service Temperature ºC

140

140


Thermally Conductive Potting Compounds  (TIM-PC Series)

Product Description :
TIM-PC series
are pourable, filled epoxy resin systems offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. These compounds transfer heat rapidly, thereby eliminating hot spots and increasing the operating efficiency of most encapsulated devices. The low shrinkage design feature minimizes risk of damage to fragile components.

Typical Applications :

These products are designed for protecting components in applications such as densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.



Property

Type

Silicone

Epoxy Resin

Epoxy Resin

Epoxy Resin

Thermal Conductivity W/mºK

1.2

0.63

0.60

1.3

Type/Cure                                                                  

Two Part-RT Cure

Two Part-RT Cure

Two Part-RT Cure

Two Part-RT Cure

Mix Ratio

100:100

100:12

100:100

Depends on Hardener

Pot life(100grams)

½ hr @ 25°C

2 hr @ 25°C

1-2 hr @ 25°C

½ hr @ 25°C

Cure Schedule

24-48 hrs @ 25°C

24-48 hrs @ 25°C

24-48 hrs @ 25°C

24-48 hrs @ 25°C

Shelf life

1 Year @25ºC

1 Year @25ºC

1 Year @25ºC

1 Year @25ºC

Dielectric strength, V/Mil

460

480

415

460

Max. Service Temperature ºC

140

120

110

140


 
 
 
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35 Old Dock Rd., Yaphank, NY 11980
Ph.: (631) 345-6509 • Fax: (631) 775 - 4023 E-mail: info@timtronics.com
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