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Thermally Conductive Epoxies Adhesives

TIM-800 series

Product Description:

TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non-silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.

Typical Applications:

Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.

One Part Thermally Conductive EpoxyAdhesives

Property813813LV813HTC811HP
TypeOne Part/Heat CureOne Part/Heat CureOne Part/Heat CureOne Part/Heat Cure
Special FutureThixotropic.
No Sag.
High Bond Strength at high temperature.
Low viscosity.
Thixotropic.
No Sag.
High Bond Strength at high temperature.
High Thermal Conductivity.
Thixotropic.
No Sag.
High Bond Strength at high temperature.
Low Temp Cure.
High temp resistance.
Excellent water, solvent & chemical resistance.
ApplicationLEDs, Thermal die attach, damming.LEDs, Thermal die attach, dammingLaser diodes, photovoltaic, high power RF amplifiersAerospace/high temperature applications
Mix Ratio by volume    
ColorBlackBlackBlackGray
Shelf Life4 months@ 25°C
6 months@ 5°C
4 months@ 25°C
6 months@ 5°C
4 months@ 25°C
6 months@ 5°C
4 months@ 25°C
6 months@ 5°C
Viscosity @25°Ccp1,200,000800,000900,000Paste
Gel Time (Pot Life) (100 grams)30 Min@ 80°C30 Min@ 80°C30 Min@ 80°C>180 Min
Cure Schedule30 min@ 150°C or
60 min@ 125°C
30 min@ 150°C or
60 min@ 125°C
30 min@ 150°C or
60 min@ 125°C
10 min@ 150°C or
45 min@ 125°C
Fixture Time5-10 min@ 150°C5-10 min@ 150°C5-10 min@ 150°C5-10 min@ 150°C
Hardness (Shore D)90909084
Glass Transition Temperature145°C145°C145°C130°C
Lap Shear Strength. Aluminum2620psi2620psi2620psi4500psi
Service Temperature Range-55°C  to 200°C-55°C  to 200°C-55°C  to 200°C-55°C  to 230°C
THERMAL    
Thermal Conductivity (W/m-K)1.81.82.71.5
ELECTRICAL    
Dielectric Strength   (Volts/Mil)460460460350
Volume Resistivity   (Ohm-cm)10^1510^1510^1510^15

 

Two Parts Thermally Conductive Epoxy Adhesives

Property827TC885816TC816HTC818802F
Special FutureHigh Strength.
Crack Resistance.
Non-HazmatVibration resistance, low temperature flexibility.Very High Thermal Conductivity.
Superior metal to metal bonding.
Flash Cure in 5 minutes.
No mix type
Structure bonding. Vibration & Shock Resistance.
Variety mix ratio offers desire hardness
TypeTwo PartsTwo PartsTwo PartsTwo PartsTwo Parts
/No Mix
Two Parts
HardenerN/AEH-22N/AN/A63EH-14
Mix Ratio by Wt (A/H)100/46100/7100/100100/100No Mix type100/100(see TDS to choose mix ratio
ColorGrayBlackBlackGrayWhiteClear/Amber
Shelf Life12 months@ 25°C12 months@ 25°C12 months@ 25°C12 months@ 25°C12 months@ 25°C4 months@ 25°C
6 months@ 5°C
Mixed Viscosity @25°Ccp120,000Paste>250,000PastePasteSee TDS
Gel Time (Pot Life) (100 grams)60 Min @ 25°C40 Min@ 25°C45 Min@ 25°C80 Min@ 25°CN/A120 Min@ 25°C
Cure Schedule24 hrs@ 25°C or
30 min@ 90°C
24 hrs@ 25°C or
30 min@ 100°C
24 hrs@ 25°C or
60 min@ 80°C
24 hrs@ 25°C or
30 min@ 90°C
5 minutes @ 25°C.
Flash cure.
24 hrs @ 25°C or
60 min@ 100°C
Cured Properties      
Hardness (Shore D)869181869180
Glass Transition Temperature62°C>70°C90°C90°CN/A85°C
Lap Shear Strength. Alumimum>3500psi>3000psi3000psi>3500psi1860psi3200psi
Service Temperature Range-55°C  to 100°C-55°C  to 150°C-55°C  to 150°C-55°C  to 160°C-55°C  to 150°C-55°C  to 230°C
THERMAL      
Thermal Conductivity (W/m-K)0.91.31.62.70.8N/A
ELECTRICAL      
Dielectric Strength   (Volts/Mil)420430420420570430
Volume Resistivity   (Ohm-cm)10^1110^1510^1410^1110^1310^15