TIMTRONICS - Thermal Interface Material  
 

TIM-LGF
Dispensable Liquid Gap Fillers



Product Description:TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and good compression set or memory. This material is available in thermally conductive & electrically insulating or conductive, one part or two part, room or elevated temperature curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.

Typical Appllication: LED bonding, PCBA to housing, discrete component to heat spreader, Computer and Peripherals and Automotive Electronics.

Most Popular Products:


  • TIM-LGF 2000: One part, heat cure silicone liquid gap filler ideal for coupling hot PC board components to heat sink. It forms soft elastomer in 15 minutes when expose to heat.
  • TIM-LGF 2004: Two part, room temperature cure, simple 1:1 mix ratio for easy application. Forms soft elastomer in 5 minutes when expose to heat. Very efficient heat dissipater.

Property
Viscosity cps
150,000
600,000
500,000
150,000
Mix Ratio
One Part
Heat Cure
One Part
RTV
One Part
RTV
Two Part
1:1
Thermal Conductivity, W/ m °K
2.0
0.63
N/A
2.0
Volume Resistivity, Ohm-cm
1012
1015
0.09
1012
Cure time @ 25°C
N/A
72 Hrs.
24 Hrs.
2 Hrs.
Cure time @ 120°C
30 Minutes
N/A
N/A
5 Minutes
Pot Life @ 25°C
24 Hrs.
8 Minutes
15 Minutes
1 Hr.
Hardness, shore 00/(A)
70
40(A)
40(A)
70
 
 
 
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35 Old Dock Rd., Yaphank, NY 11980
Ph.: (631) 345-6509 • Fax: (631) 775 - 4023 E-mail: info@timtronics.com
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