TIMTRONICS - Thermal Interface Material  
 
TIM-PAD
Thermally Conductive Pads


  • Product Description : TIM-PAD is a family of thermally conductive and electrically insulating silicone pads. They are clean, production friendly and efficient alternative to mica, ceramics or grease and will provide superb protection against damage due to deformation, shock or vibration. Available with or without adhesive for easy handling and installation.

  • Typical Application : Interface between a power transistor, CPU or other heat-generating components. Isolate electrical components and power sources from heat sink and/or mounting brackets. Interface for discrete semiconductors requiring low pressure spring clip mounting. Medical devices, military and industrial controls.

Most Popular Products :

• TIM-PAD 1001: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. Excellent mechanical and physical characteristics with efficient heat dissipation. Flame retardant with excellent cut-through resistance and resistance to damage from cleaning agents.
• TIM-PAD 1003: Offers high thermal conductivity (3W/m°k) and high dielectric properties.
• TIM-GEL PAD: Very soft, highly conformable pad provides superb protection against damage due to deformation as well as shock or vibration. Gel like modulus provides stress absorbing flexibility.

Physical Property
Test Method
Type
Silicone
Silicone
Silicone
Silicone
Thermal Conductivity W/m °k
ASTM D5470 Modified
1.1
1.6
3.0
1.6
Thermal Resistance °Cin2/W
(Thickness)
TO-3 method
0.51 (0.08”)
0.55(0.08”)
0.3(0.08”)
0.35(0.01”)
Volume Resistivity ohm - cm
ASTM D257
1015
1015
1015
1015
Hardness Shore 00
ASTM D2240
86
93
84
49
Elongation %
ASTM D412
<2
<2
<3
N/A
Max. Service Temperature  °C
200
200
200
150
Available thickness, mm
0.15,0.20,0.30
0.15,0.20,0.30
0.20,0.30 0.45,0.85
0.20,0.30 0.45,0.85
0.25
 
 
 
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35 Old Dock Rd., Yaphank, NY 11980
Ph.: (631) 345-6509 • Fax: (631) 775 - 4023 E-mail: info@timtronics.com
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