Product Description : TIM-PUTTY is ‘Ultra Soft” and highly conformable paste- type gap filler. Its “ultra soft” consistency assures efficient heat transfer between delicate parts where minimum pressure can be tolerated. This Form-in-place gap filler is ideal for applying any thickness with little or no stress. It is designed to provide a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. TIM-PUTTY easily forms and adheres to most surfaces, shapes and sizes of components with very low compression force. Non-Silicone formulas avoid silicone contaminations to delicate devices. It can be easily dispensed from cartridges or pail using pneumatic dispenser.
Typical Application :TIM-PUTTY is used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. TIM-Putty materials allow the designer to be less concerned of CTE stresses during thermal cycling.
Most Popular Products :
TIM-PUTTY 418: Non-Silicone, cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.1W/mºK) with low modulus
TIM-PUTTY 418HTC: Non-Silicone, highly conformable, thermally conductive and electrically Insulating. Commonly used in uneven, irregular surfaces to fills air gaps. High thermal conductivity (3.2W/mºK) with low modulus.
Availability : Tim-Putty are generally supplied in 30 cc syringe, 6 & 12 oz cartridge or 5 gallon pail