Gray Ice 4060: Highest thermal conductive grease, specially recommended for high heat flux application where lowest thermal resistance required with zero pump out property. Thermal Conductivity 6.0 w/m°K
Gray Ice 4050LV: High thermal conductive grease, specially recommended for high heat flux application where lowest thermal resistance required with zero pump out property. Thermal Conductivity 5.0 w/m°K
Gray Ice 4100LV: Non silicone, specially formulated with low viscosity for thin bond line thickness and screen printable consistency. Thermal Conductivity 3.2 w/m°K
Red Ice 611HTC: High temperature stable, high thermal conductive grease offers operating temperature range up to 360*C. Thermal Conductivity 3.2 w/m°K
Silver Ice 710NS: Electrically and Thermally conductive, non curable grease, formulated with pure Silver particles to achieve optimum thermal and electrical properties. Thermal Conductivity 7 w/m°K, Volume Resistivity <0.10 ohm-cm
TIM-PUTTY 418HTC: UL95 V-0 approved, Non Silicone, high viscosity, non curable highly thermally conductive gap filler, recommended for application where zero stress to components required. Application where multiple components with different heights and need thermal transfer with one heat sink. Thermal Conductivity 3.2 w/m°K
TIM-PUTTY 5W: Non Silicone, high viscosity, non curable gap filler, recommended for application where zero stress to components required. Application where multiple components with different heights and need thermal transfer with one heat sink. Thermal Conductivity 5.0 w/m°K
LGF 2004: Silicone based, curable liquid gap filler, mixture of part A & B forms rubber type flexible film. Recommended for multiple gap type application with vibration dampening and potting applications. Thermal Conductivity 2.0 w/m°K
LGF 2030: Silicone based, controlled cured liquid gap filler, mixture of part A & B forms very soft rubber with low durometer. Recommend for application where zero stress to components and vibration dampening required. Thermal Conductivity 3.5 w/m°K
TIM-GAP HTC-11: High conductivity Silicone gap filler, recommend filling large gap where efficient heat transfer required, available in die cut to size. Available in 0.06:, 0.08” & 0.12” thickness. Thermal Conductivity 11.0 w/m°K,
TIM-GAP HTC-16: High conductivity Silicone gap filler, recommend filling large gap where efficient heat transfer required, available in die cut to size. Thermal Conductivity 16.0 w/m°K,
TIM-816HTC: Two part, room temperature curable thermally conductive and electrically insulating epoxy. Operating temperature range up to 150°C. Thermal Conductivity 2.7 w/m°K
TIM-813HTC: One part, heat cure thermally conductive and electrically insulating epoxy. Operating temperature range up to 150°C. Thermal Conductivity 2.7 w/m°K