Thermally Conductive Epoxies and Potting Compounds
Fast curing, one part/two part.High thermal conductivity with high bond strength.
Thermally Conductive Silicone Potting Compounds
TIM-PC Series
Product Description
Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies.
Typical Applications
Potting and encapsulating of:
Equipment modules, Power supplies, relays and amplifiers, Transformers, coils and ferrite cores