Thermally Conductive Silicone Potting Compounds

TIM-PC Series

Product Description:

Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies.

Typical Applications:

Potting and encapsulating of:

  • Equipment modules, Power supplies, relays and amplifiers, Transformers, coils and ferrite cores
  • Fiber optic wave guide coatings
  • Encapsulation of circuit boards
Special FutureFlame Retardant
Flexible, impact and thermal shock resistance.
Low Viscosity
Long pot life
High Dielectric
High Temperature rated up to 240°C
Meets UL94V0
Long pot life
Fast cure
TypeTwo PartsTwo PartsTwo Parts
Mix Ratio by Wt (A/H)1:11:11:1
Shelf Life12 months@ 25°C12 months@ 25°C12 months@ 25°C
Mixed Viscosity @25°C  cp400013002000
Gel Time (Pot Life) (100 grams)1 hr @ 25°C2 hr @ 25°C2 hr @ 25°C
Cure Schedule24-48 hrs@ 25°C or
2 hrs @ 70°C
24-48 hrs@ 25°C or
30 minutes @ 100°C
24 hrs@ 25°C or
15 minutes@ 150°C
Cured Properties   
Hardness (Shore )A-42A-62A-46
Tensile Strength>250psi450psi>280psi
Service Temperature Range-55°C  to 200°C-55°C  to 200°C-55°C  to 240°C
Thermal Conductivity  (W/m-K)1.20.650.40
Dielectric Strength   (KV/mm)17.52617.5
Volume Resistivity   (Ohm-cm)10^1410^1510^15