Thermally Conductive Silicone Potting Compounds
TIM-PC Series
Product Description
Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies.
Typical Applications
Potting and encapsulating of:
- Equipment modules, Power supplies, relays and amplifiers, Transformers, coils and ferrite cores
- Fiber optic wave guide coatings
- Encapsulation of circuit boards
| Property | 8550TC | 8550AC | 8556 |
| Special Future | Flame Retardant Self-Bonding Flexible, impact and thermal shock resistance. |
Low Viscosity Long pot life. High Dielectric |
High Temperature rated up to 240C Meets UL94V0 Long pot life Fast cure |
| Type | Two Parts | Two Parts | Two Parts |
| Mix Ratio by Wt (A/H) | 1:1 | 1:1 | 1:1 |
| Color | Gray | Gray | Black |
| Shelf Life | 12 months@ 25°C | 12 months@ 25°C | 12 months@ 25°C |
| Mixed Viscosity @25°Ccp | 4000 | 1300 | 2000 |
| Gel Time (Pot Life) (100 grams) | 1 hr @ 25°C | 2 hrs @ 25°C | 3 hrs @ 25°C |
| Cure Schedule | 24-48 hrs@ 25°C or 2 hrs @ 70°C |
24-48 hrs@ 25°C or 30 minutes @ 100C |
24 hrs@ 25C or 15 minutes@ 150C |
| Cured Properties | |||
| Hardness (Shore ) | A-42 | A-62 | A-46 |
| Tensile Strength | >250psi | 450psi | >280psi |
| Service Temperature Range | -55C to 200C | -55C to 200C | -55C to 240C |
| THERMAL | |||
| Thermal Conductivity (W/m-K) | 1.2 | 0.65 | 0.40 |
| ELECTRICAL | |||
| Dielectric Strength (KV/mm) | 17.5 | 26 | 17.5 |
| Volume Resistivity (Ohm-cm) | 10^14 | 10^15 | 10^15 |