Silicone Potting Compounds

Thermally Conductive Silicone Potting Compounds

TIM-PC Series

Product Description

Thermally Conductive, two parts, low viscosity potting compound that cures at room temperature to a soft pliable rubber. Will cure in deep sections. Designed to achieve primerless adhesion to many substrates, including metals, plastics, and ceramics. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies.

Typical Applications

Potting and encapsulating of:

Equipment modules, Power supplies, relays and amplifiers, Transformers, coils and ferrite cores
Fiber optic wave guide coatings
Encapsulation of circuit boards

Property	8550TC	8550AC	8556
Special Future	Flame Retardant Self-Bonding Flexible, impact and thermal shock resistance.	Low Viscosity Long pot life. High Dielectric	High Temperature rated up to 240C Meets UL94V0 Long pot life Fast cure
Type	Two Parts	Two Parts	Two Parts
Mix Ratio by Wt (A/H)	1:1	1:1	1:1
Color	Gray	Gray	Black
Shelf Life	12 months@ 25°C	12 months@ 25°C	12 months@ 25°C
Mixed Viscosity @25°Ccp	4000	1300	2000
Gel Time (Pot Life) (100 grams)	1 hr @ 25°C	2 hrs @ 25°C	3 hrs @ 25°C
Cure Schedule	24-48 hrs@ 25°C or 2 hrs @ 70°C	24-48 hrs@ 25°C or 30 minutes @ 100C	24 hrs@ 25C or 15 minutes@ 150C
Cured Properties
Hardness (Shore )	A-42	A-62	A-46
Tensile Strength	>250psi	450psi	>280psi
Service Temperature Range	-55C to 200C	-55C to 200C	-55C to 240C
THERMAL
Thermal Conductivity (W/m-K)	1.2	0.65	0.40
ELECTRICAL
Dielectric Strength (KV/mm)	17.5	26	17.5
Volume Resistivity (Ohm-cm)	10^14	10^15	10^15