Customized Thermal Management Solutions
Global leader in most advanced Silicone-Free Thermal Interface Materials. Rapid Product Design and Sampling.
High Performance Thermal Greases
Low Cost Thermal Solution for High-End Microprocessor. High thermal Conductivity up to 6 w/m°k
High temperature stable up to 360°C. NSF H1 approved food grade thermal greases.
Dispensable Liquid Gap Fillers
Zero stress to components, Non-silicone/No Cure advantages
Conforms to any size, shape with minimum pressure.
Solid Gap Fillers and Pads
Extremely soft, Gel type compressible, Thermal conductivity up to 16 w/m°k.
Thermally Conductive Epoxies and Potting Compounds
Fast curing, one part/two part.High thermal conductivity with high bond strength.
Timtronics founded in 2003 is an ISO 9001:2015 certified manufacturer and formulator of the most Advanced Thermal Interface Materials. Timtronics is a global leader in Non Silicone (Silicone Free) thermal interface materials. We partner with O.E.M. companies to develop high performance thermal interface materials using our proprietary technology and engineering expertise. Each new product formulation is designed to meet and exceed O.E.M. specifications. We pride ourselves on rapid product design, sampling, flexible production methodology and world class technical support. Timtronics CustomerEnrichment Program (CEP) guarantees unparalleled customer service, consistent quality products and provides the next generation of thermal interface technology. Timtronics has over 50 years of experienced chemists and engineers to assist you in finding solutions to your most demanding applications.
Timtronics products have been designed into thousands of applications and helps guarantee the performance, integrity, survivability, and maintainability of communications equipment, automotive, radars, aircraft, missiles, spacecraft, computers, fire control systems and industrial electronics.
Timtronics is a one stop for thermal management solutions, we offer a full line of thermal greases, pads, gap fillers, cure and non- cure types dispensable gels, epoxies and potting compounds