TIM-LGF
Dispensable Liquid Gap Fillers
Product Description :
TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and good compression set or memory. This material is available in thermally conductive & electrically insulating or conductive, one part or two part, room or elevated temperature curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.
Typical Appllication:
LED bonding, PCBA to housing, discrete component to heat spreader, Computer and Peripherals and Automotive Electronics.
Most Popular Products:
TIM-LGF 2000: One part, heat cure silicone liquid gap filler ideal for coupling hot PC board components to heat sink. It forms soft elastomer in 15 minutes when expose to heat.
TIM-LGF 2004: Two part, room temperature cure, simple 1:1 mix ratio for easy application. Forms soft elastomer in 5 minutes when expose to heat. Very efficient heat dissipater.
| Physical Property | 2000 | 2001 | 2002 Electrically Conductive | 1003 |
|---|---|---|---|---|
| Viscosity cps | 150,000 | 600,000 | 500,000 | 150,000 |
| Mix Ratio | One Part Heat Cure | One Part RTV | One Part RTV | Two Part 1:1 |
| Thermal Conductivity, W/ m °K | 2.0 | 0.63 | N/A | 2.0 |
| Volume Resistivity, Ohm-cm | 1012 | 1015 | 0.09 | 1012 |
| Cure time @ 25°C | N/A | 72 Hrs. | 24 Hrs. | 2 Hrs. |
| Cure time @ 120°C | 30 Minutes | N/A | N/A | 5 Minutes |
| Pot Life @ 25°C | 24 Hrs. | 8 Minutes | 15 Minutes | 1 Hr. |
| Hardness, shore 00/(A) | 70 | 40(A) | 40(A) | 70 |