Customized Thermal Management Solutions
Global leader in most advanced Silicone-Free Thermal Interface Materials. Rapid Product Design and Sampling.
High Performance Thermal Greases
Low Cost Thermal Solution for High-End Microprocessor. High thermal Conductivity up to 6 w/m°k
High temperature stable up to 360°C. NSF H1 approved food grade thermal greases.
Dispensable Liquid Gap Fillers
Zero stress to components, Non-silicone/No Cure advantages
Conforms to any size, shape with minimum pressure.
Solid Gap Fillers and Pads
Extremely soft, Gel type compressible, Thermal conductivity up to 16 w/m°k.
Thermally Conductive Epoxies and Potting Compounds
Fast curing, one part/two part.High thermal conductivity with high bond strength.
Timtronics advancing further with Non Silicone technology and introducing new Non Silicone high performance thermal greases with high thermal conductivity, low viscosity, screen printable consistency with low BLT (<10 micron)
High performance thermal grease designed to meet the thermal, reliability and low price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. Specially formulated with tacky texture which helps to control pump out during thermal cycling. Dispensable and screen printable consistency makes easy in production environment.
These new compounds shows superior performance compared to most popular thermal greases on market (Arctic Silver 5, Mx-4, Shin-etsu 751, Dow 5022 and Momentive TIG 830 etc)
Physical Properties:
Property
Test Method
4050LV
4060
Type
Silicone Free
Silicone Free
Special Future
Tacky, Zero Pump out
High TC, Stable
Color
Visual
Gray
Gray
Viscosity 5 rpm @ 25°C, PaS
Helipath
480
700
Specific Gravity
ASTM D792
2.4
2.4
Operating Temperature Range.°C
-55°C to 200°C
-55°C to 200°C
Shelf Life
5 years
5 years
THERMAL
Thermal Conductivity (W/m-K)
ASTM D5470
5.0
6.0
Thermal Resistance °C-in²/W
ASTM D5470
0.005
0.003
ELECTRICAL
Breakdown Voltage (KV/mm)
ASTM D149
2.8
2.8
Dissipation Factor (1KHz)
ASTM D150
0.12
0.12
Volume Resistivity (Ohm-cm)
ASTM D257
10^9
10^9
Performance (“Burn In”) Data:
CPU Test Run Time
Delta T ⁰C
Thermal Resistance (*C-In2/W)
Delta T ⁰C
Thermal Resistance (⁰C-In2/W)
Grey Ice 4060
Grey Ice 4060
4050LV
4050LV
30 minutes
4.1
0.050
7.0
0.082
24hrs
3.6
0.045
5.4
0.064
48hrs
3.1
0.038
4.6
0.055
72hrs
3.1
0.038
4.5
0.055
For further details, please call application engineer at 631-345-6509
