TIM-LGF are thermally conductive liquid gap filler materials formulated to provide a balance of cured material properties, highlighted by “gel-like” modules and good compression set or memory. This material is available in thermally conductive & electrically insulating, one part or two part, room or elevated temperature curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress.
Ideal for circuit boards where multiple packages of variable heights require a thermal path to heat sink or enclose. Automotive Electronics Control Units (ECU’s), power supplies & semiconductors, memory and power modules and fiber optics telecommunications equipment.
50cc& 400cc dual Syringes/Cartridges, 1/10 gallon caulking cartridge& 10 gallonsKits
Property | Test Method | 2004 | 2005 | 2006 | 2007 | 2030 | 2301 |
Type | Two Parts Silicone | Two Parts Silicone | Two Parts Silicone | Two Parts Silicone | Two Parts Silicone | One Part Silicone |
|
Special Futures | High Viscosity No Slump |
Very soft/Gel type cure | Controlled cure,No Slump Grease/Paste type cure |
Soft cure High TC |
Soft cure High TC Thixotropic |
Fast Cure RTV Sealant |
|
Color | Visual | Pink | Grey | Blue | Blue | Blue | White |
Mixed Viscosity. PaS | Brookfield | 150 | 73 | 120 | 80 | 400 | N/A |
Mix Ratio | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | N/A | |
Specific Gravity | ASTM D792 | 2.8 | 2.0 | 2.1 | 2.5 | 2.5 | 1.29 |
Hardness(Shore 00) | ASTM D2240 | 70 | <5 | Thixotropic Paste | 45 | 35 | 35 |
Pot Life @ 25°C | 60 min | 90 min | 24 hrs | 90 min | 60 min | 15 min | |
Cure Time @ 25°C | 24-48 hrs | 24-48 hrs | 48 hrs | 24-48 hrs | 24-48 hrs | 24 hrs | |
Cure Time @ 100°C | 20 min | 30 min | 5 min | 30 min | 30 min | N/A | |
Flammability (Equivalent) |
UL 94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
Operating Temperature Range. | -55°C to 204°C | -55°C to 204°C | -55°C to 204°C | -55°C to 204°C | -55°C to 204°C | -55°C to 260°C | |
Shelf Life(Unopened) | 12 months | 12 months | 12 months | 12 months | 12 months | 12 months | |
THERMAL | |||||||
Thermal Conductivity (W/m-K) | ASTM D5470 | 2.0 | 1.2 | 0.8 | 1.5 | 3.5 | 0.20 |
ELECTRICAL | |||||||
Breakdown Voltage (KV/mm) | ASTM D149 | 12 | 12 | 12 | 12 | 13 | 12 |
Volume Resistivity (Ohm-m) | ASTM D257 | 10¹² | 10¹² | 10¹² | 10¹² | 10¹² | 10¹² |