TIM-GAP series is designed to meet industry’s growing need for interface material with high conductivity and greater conformability for easier application. Electrically isolating property allows its use in applications requiring isolations between heat sinks and high voltage, bare leaded devices. Available in Silicone and Non Silicone formulas, thermal conductivity up to 16 W/mºK
P Series are extremely soft, gel type products,highly conformable thermal interface gap filler designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications.
Gap Fillers are used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. Gap Filler materials allow the designer to be less concerned with components proximity to heat sinks or heat spreaders.
TIM-GAP HTC-16: High thermal conductivity (16 W/mºK) with low modulus. Excellent choice for high speed processor with very high heat flux in small area.
TIM-GAP 1161: Conformable, thermally conductive with electrically insulated. Commonly used in uneven, irregular surfaces to fill air gaps. High thermal conductivity (6.1 W/mºK) with low modulus.
TIM-GAP 1128: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.8 W/mºK) with low modulus.
TIM-GAP 1113: Low Cost solution. Specially designed for extremely low stress applications, clean, production friendly, lowest modulus type, viscoelastic thermal interface material.
Sheet form (200mm x 300mm) and Custom die-cut parts
Property | Test Method | 1113 | 1115 | 1128 | 1161 | HTC-13 | HTC-16 | NS |
Type | Silicone | Silicone | Silicone | Silicone | Silicone | Silicone | Non-Silicone | |
Color | Visual | Pink | Gray | Gray | Gray | Gray | Gray | Gray |
Specific Gravity, @ 25°C | ASTM D792 | 2.0 | 2.1 | 2.5 | 3.22 | 3.3 | 3.2 | 2.1 |
Hardness (Shore 00) | ASTM D2240 | 24 | 25 | 50 | 45 | 75 | 72 | 53 |
Flammability (Equivalent) | UL 94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
Operating Temperature Range. | -40°C to150°C | -40°C to150°C | -40°C to150°C | -40°C to 150°C | -40°C to 150°C | -40°C to 150°C | -40°C to150°C | |
THERMAL | ||||||||
Thermal Conductivity (W/m-K) | ASTM D5470 | 1.3 | 1.7 | 2.8 | 6.1 | 13.2 | 16.0 | 1.6 |
Thermal Resistance with Pressure (°C-in2/w) (1 mm Th) | ASTM D5470 | 15psi 0.93 40psi 0.71 70psi 0.60 | 15psi 0.97 40psi 0.80 70psi 0.70 | 15psi 0.55 40psi 0.44 70psi 0.40 | 14psi 0.37 50psi 0.31 70psi 0.28 | 14psi 0.16 50psi 0.15 70psi 0.14 | 14psi 0.13 50psi 0.12 70psi 0.11 | 14psi 1.02 50psi 0.78 70psi 0.61 |
ELECTRICAL | ||||||||
Breakdown Voltage (KV/mm) | ASTM D149 | 16 | 13 | 14 | 14 | 12 | 10 | 11 |
Dielectric Constant (1KHz) | ASTM D150 | N/A | 4.2 | 6.0 | 8.1 | 8.6 | 4.5 | 7.2 |
Dissipation Factor (1KHz) | ASTM D150 | N/A | 0.04 | 0.03 | 0.02 | 0.04 | 0.05 | 0.04 |
Volume Resistivity (Ohm-m) | ASTM D257 | 1.2 x 10¹² | 1.1 x 10¹² | 1.2 x 10¹² | 1.5 x 10¹¹ | 1.0 x 10¹¹ | 1.0 x 10¹¹ | 1.0 x 10¹² |
Available Thickness.mm | 0.5 to 5.0 | 0.5 to 5.0 | 0.5 to 5.0 | 0.5 to 5.0 | 0.5 to 3.0 | 0.3 to 3.0 | 0.5 to 3.0 | |
Available Sheet size | 300mm x 200mm | 300mm x 200mm | 300mm x 200mm | 300mm x 200mm | 300mm x 200mm | 300mm x 200mm | 300mm x 200mm |
These gel type gap fillers require very low compression force at high compression rates, allowing it to gently conform to most component shapes and uneven surfaces.
This advanced thermal interface material is ideal for applications that have delicate or wide-variation component heights and require material compression between 30% and 80%.
Property | Test Method | P-28 | P-61 | HTC-11 | P-13 |
Type | Silicone | Silicone | Silicone | Silicone | |
Color | Visual | Gray | Reddish/Grey | Gray | Blue |
Specific Gravity, @ 25°C | ASTM D792 | 2.6 | 3.11 | 3.3 | 3.3 |
Hardness (Shore 00) | ASTM D2240 | 26 | (Gel type) | (Gel type) | (Gel type) |
Flammability | UL 94 | V-0 Equivalent | V-0 Equivalent | V-0 Equivalent | V-0 Equivalent |
Operating Temperature Range. | -40°Cto150°C | -40°C to 150°C | -40°C to 150°C | -40°C to150°C | |
THERMAL | |||||
Thermal Conductivity (W/m-K) | ASTM D5470 | 2.8 | 6.1 | 11.0 | 13.2 |
Thermal Resistance with compression (°C-in2/w) (1 mm Thickness) | ASTM D5470 | 15psi 0.43 40psi 0.30 70psi 0.22 | 15psi 0.30 40psi 0.20 70psi 0.12 | 15psi 0.22 40psi 0.12 70psi 0.07 | 15psi 0.16 40psi 0.07 70psi 0.05 |
ELECTRICAL | |||||
Breakdown Voltage (KV/mm) | ASTM D149 | 18 | 12 | 11 | 12 |
Dielectric Constant (1KHz) | ASTM D150 | 6.4 | 7.2 | 7.8 | 7.8 |
Dissipation Factor (1KHz) | ASTM D150 | 0.030 | 0.020 | 0.017 | 0.040 |
Volume Resistivity (Ohm-m) | ASTM D257 | 1.0 x 10¹² | 1.2 x 10¹² | 1.0 x 10¹º | 1.2 x 10¹² |
Available thickness. mm | 1.5 to 5.0 | 1.5,2.0,2.5 | 1.0 to 3.0 | 0.5 to 2.0 | |
Available Sheet size | 300mm x 200mm | 300mm x 200mm | 300mm x 200mm | 300mm x 200mm |